Two-Dimensional Layout For Use In A Complex Structure

ABSTRACT

A method for manufacturing a complex structure from a two-dimensional layout, the method comprising: (a) obtaining a support plate having a pre-determined, patterned recess formed in a surface thereof; (b) depositing a first series of individual flexible interconnects into the recess, the flexible interconnects being aligned parallel to one another in a common plane and supported by the support plate; (c) adhering, with adhering means, at least one rigid member to each of the flexible interconnects of the first series; (d) adhering, with adhering means, a second series of individual flexible interconnects to the rigid members to form a plurality of stations, wherein each of the second series of flexible interconnects is adhered to two rigid members of adjacent flexible interconnects of the first series, the flexible interconnects of the second series being formed perpendicular to the flexible interconnects of the first series; (e) curing the adhering means to form an assembled, layered structure; (f) removing the layered structure from the support plate; and (g) folding, systematically, the layered structure on itself and causing at least some of the stations to be supported about a central spine in a segmented manner.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.12/151,730, filed May 7, 2008, and entitled “Method for Manufacturing aComplex Structure”, which claims the benefit of U.S. ProvisionalApplication Ser. No. 60/928,149, filed May 7, 2007, and entitled,“Method for Manufacturing a Complex Structure,” each of which areincorporated by reference herein in their entirety.

FIELD OF THE INVENTION

The present invention relates generally to complex structures, such asrobotic devices or medical devices, and more particularly to a methodfor manufacturing a complex structure.

BACKGROUND OF THE INVENTION AND RELATED ART

Complex structures, such as high aspect ratio structures, or guidewires,have long been used in medical, industrial, and other fields forinsertion into a lumen or conduit or other similar ducted structure forone or more purposes. For example, in the medical field an endoscope isa medical instrument for visualizing the interior of a patient's body.Endoscopes can be used for a variety of diagnostic and interventionalprocedures, including, colonoscopy, bronchoscopy, thoracoscopy,laparoscopy, and video endoscopy. The use of guidewires in applicationsother than those for medical purposes include any applications in whichit is desirable to inspect, repair, position an object such as toolswithin, or otherwise facilitate travel into and through a tube, pipe, orother similar conduit for one or more purposes.

As is known, a guidewire having a relatively low resistance to flexureyet relatively high torsional strength is most desirable. Stateddifferently, it is often desired that certain portions or all of aguidewire have lateral flexibility characteristics as well aspushability (the ability to push) and torquability (the ability totorque or twist the guidewire with sufficient torsional or rotationalstiffness) characteristics. As the guidewire is advanced into theanatomy, internal frictional resistance resulting from the typicallynumerous turns and attendant surface contacts, decreases the ability toturn the guidewire and to advance the guidewire further within theluminal space. This, in turn, may lead to a more difficult and prolongedprocedure, or, more seriously, failure to access the desired anatomy atthe target location and thus a failed procedure.

A guidewire with high flexibility helps overcome the problems created bythis internal resistance. However, if the guidewire does not also havegood torque characteristics (torsional stiffness), the user will not beable to twist the proximal end in order to rotate the distal tip of theguidewire to guide its advance as required. Indeed, depending upon itsuse, a guidewire may be required to have adequate torsional strengthover its length to permit steering of the distal tip portion into thecorrect vessel branches by axially rotating the proximal end. Theguidewire, and especially the distal end portion, may be required to besufficiently flexible so that it can conform to the acute curvature ofthe vessel network. Additionally, a guidewire with compression strengthmay be needed, wherein the compression strength is suitable for pushingthe guidewire into the vessel network without collapsing.

Other complex structures include hyper redundant robotic structures,such as serpentine or snake robots capable of mimicking the locomotionof a snake. Such robotic devices may be configured to perform variousfunctions, such as to negotiate complicated three-dimensional spacesincluding pipes, stairs, vertical piles of rubble, etc. These roboticdevices commonly comprise a plurality of actuated jointed segments thatare movable with respect to one another in various degrees of freedomvia a plurality of servo or other similar valves. In addition, they maybe equipped with various devices, such as cameras, sensors, and othertechnology depending upon their intended use.

Current methods of fabricating or manufacturing small, three-dimensionalcomplex structures requires assembling the structure one segment at atime. Any components or systems to be incorporated into one or moresegments must also be assembled thereon as the segments are being puttogether. This rudimentary method is complicated even further whenvarious electrical connections are desired to be incorporated to providepower and electrical signal carrying capabilities to the complexstructure. Such manufacturing methods do not lend the complex structureto mass production, thus increasing the cost of each structure and thetime to production.

SUMMARY OF THE INVENTION

In light of the problems and deficiencies inherent in the prior art, andin accordance with the invention as embodied and broadly describedherein, the present invention features a method for manufacturing acomplex structure from a two-dimensional layout, the method comprising:(a) obtaining a support plate having a pre-determined, patterned recessformed in a surface thereof; (b) depositing a first series of individualflexible interconnects into the recess, the flexible interconnects beingaligned parallel to one another in a common plane and supported by thesupport plate; (c) adhering, such as with adhering means, at least onerigid member to each of the flexible interconnects of the first series;(d) adhering, such as with adhering means, a second series of individualflexible interconnects to the rigid members to form a plurality ofstations, wherein each of the second series of flexible interconnects isadhered to two rigid members of adjacent flexible interconnects of thefirst series, the flexible interconnects of the second series beingformed perpendicular to the flexible interconnects of the first series;(e) curing the adhering means to form an assembled, layered structure;(f) removing the layered structure from the support plate; and (g)folding, systematically, the layered structure on itself and causing atleast some of the stations to be supported about a central spine in asegmented manner.

In one exemplary embodiment, the flexible material may be a metalizedpolyimide film, i.e. Kapton, enabling the rigid members to beelectrically interconnected, as well as allowing the complex structureto electrically communicate with an electronic source, such as acomputer or other electronic device or system, for one or more purposes.

The rigid members themselves may comprise one or more on-board systemsthat may be incorporated into the two-dimensional layout used to formthe complex structure. In one exemplary embodiment, an on-board systemmay enable the rigid members to function as intelligent performancestations. The rigid members may comprise computer chips or siliconsubstrates with circuitry and data processing/storing componentsthereon. In this case, each rigid member may be networked or multiplexedtogether via the metalized polyimide film material interconnecting thevarious stations. Nodes, or output stations, may also be utilizedbetween the various stations, which nodes may also electricallycommunicate with the various stations via the metalized polyimide filminterconnects.

In another exemplary embodiment, an on-board system may enable the rigidmembers to function as mechanical or fluid or electro-mechanicalperformance stations. For example, the rigid members may supportactuators and valves operable with the actuators, which actuators andvalves may be in fluid communication with a hydraulic bus runningparallel to the central spine

In essence, the present invention contemplates any component or on-boardsystem being incorporated into the layered, two-dimensional layout usedto ultimately form the complex structure.

The present invention also features a method for manufacturing a complexstructure similar to the one summarized above, only the flexiblematerial comprises a single piece design, rather than a plurality ofindividual pieces. In this embodiment, additional steps of trimming orcutting may be necessary to remove a portion of the flexible materialprior to or as the rigid members are being supported about and securedto the central spine.

The present invention further features a complex structure formed from atwo-dimensional layout, wherein the complex structure comprises: (a) acentral spine; (b) a plurality of stations situated about and supportedon the central spine; and (c) a flexible interconnect extending betweeneach of the stations, the flexible interconnect being configured tooperably interconnect the stations, and the stations being formed byadhering the flexible interconnects to a plurality of rigid memberswithin a two-dimensional layout and then folding the rigid members andthe flexible interconnects, once attached, about one another whilethreading these onto the central spine.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully apparent from the followingdescription and appended claims, taken in conjunction with theaccompanying drawings. Understanding that these drawings merely depictexemplary embodiments of the present invention they are, therefore, notto be considered limiting of its scope. It will be readily appreciatedthat the components of the present invention, as generally described andillustrated in the figures herein, could be arranged and designed in awide variety of different configurations. Nonetheless, the inventionwill be described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1 illustrates a flow diagram of a method of manufacturing a complexstructure from a two-dimensional layout, according to one exemplaryembodiment of the present invention;

FIG. 2 illustrates a perspective diagram of a support plate having arecessed pattern formed therein that is capable of receiving a firstseries of flexible interconnects in a pre-determined arrangement;

FIG. 3-A illustrates a perspective view of the support plate of FIG. 2having a plurality of rigid members deposited in pre-determinedarrangement over the flexible interconnects;

FIG. 3-B illustrates a detailed view of a single rigid member shown inFIG. 3-A as deposited over a flexible interconnect;

FIG. 4 illustrates a perspective view of the support plate of FIG. 2having a second series of flexible interconnects deposited over therigid members in a pre-determined arrangement, whereupon curing, theassembly forms a plurality of stations;

FIG. 5 illustrates the resulting layered, two-dimensional assembly asbeing folded about itself and threaded onto a central spine, thusforming the three-dimensional complex structure;

FIG. 6 illustrates the complex structure of FIG. 5 having a plurality ofelectrical taps in place to confirm the operation of any on-boardsystems existing on any of the stations; and

FIG. 7 illustrates a block diagram of a segment of a complex structure,according to one exemplary embodiment, wherein the complex structurecomprises a plurality of stations and a node, all electricallyinterconnected, all addressed, and multiplexed together, with thecomplex structure being operably coupled to a computer.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The following detailed description of exemplary embodiments of theinvention makes reference to the accompanying drawings, which form apart hereof and in which are shown, by way of illustration, exemplaryembodiments in which the invention may be practiced. While theseexemplary embodiments are described in sufficient detail to enable thoseskilled in the art to practice the invention, it should be understoodthat other embodiments may be realized and that various changes to theinvention may be made without departing from the spirit and scope of thepresent invention. Thus, the following more detailed description of theembodiments of the present invention, as represented in FIGS. 1 through7, is not intended to limit the scope of the invention, as claimed, butis presented for purposes of illustration only and not limitation todescribe the features and characteristics of the present invention, toset forth the best mode of operation of the invention, and tosufficiently enable one skilled in the art to practice the invention.Accordingly, the scope of the present invention is to be defined solelyby the appended claims.

The following detailed description and exemplary embodiments of theinvention will be best understood by reference to the accompanyingdrawings, wherein the elements and features of the invention aredesignated by numerals throughout.

Generally speaking, the present invention describes a method formanufacturing a three-dimensional, complex structure using atwo-dimensional layout, wherein the complex structure comprises aplurality of performance stations that are preferably segmented, such asintelligence and/or actuation or electro-mechanical stations. Unlikeprior related methods of manufacturing, the present invention methodaccomplishes all of the assembly of the complex structure, such asmechanical and electrical interconnects, in only a few steps, whereinthe complex structure is then formed. As such, the present inventionlends itself particularly well to mass fabrication of complexstructures.

The present invention method may be used to manufacture a variety ofdifferent types of complex structures. For instance, one generic type ofcomplex structure may comprise various electro-mechanical structures,such as robotic devices, medical devices, and others. In one particularexemplary embodiment, the complex electro-mechanical structure maycomprise an electro-mechanical guidewire configured for use in variousapplications and in various industries, such as the medical or roboticindustries, wherein the electro-mechanical guidewire comprises aplurality of performance stations having one or more on-board systemscapable of performing various intelligent (e.g., data processing, signalreceiving, signal transmitting, sensing, etc.), mechanical (e.g.,actuation, locomotion), valving, or other functions. Although thisparticular application or embodiment is set forth and discussed indetail herein, such a structure should not be construed as limiting inany way. Indeed, as one skilled in the art will recognize, a variety ofdifferent types of complex structures may be formed using themanufacturing method as described or presented herein.

Preliminarily, the term “station,” as used herein, shall be understoodto mean a rigid or semi-rigid member having at least one flexibleinterconnect connected thereto. A complex structure according to thepresent invention will typically comprise a plurality of stations, someof which may be support stations, performance stations, or both.

The term “performance station,” as used herein, shall be understood tomean a rigid member configured with or supporting thereon one or moreon-board systems. Performance stations may include intelligentperformance stations, electrical performance stations, mechanicalperformance stations, actuation performance stations, informationgathering performance stations, valving and pumping performancestations, electro-mechanical performance stations, and others. On-boardsystems may include circuitry, circuit boards, actuators, valves,sensors, transmitters, cameras, locomotion devices or systems, or anycombination of these. Those skilled in the art will recognize others.

The terms “intelligent” or “intelligence,” as used herein, shall beunderstood to describe those on-board features or components of thepresent invention having the capability to perform one or more dataprocessing functions. This may include the capability to receive,process, send, and store electronic signals.

The present invention provides several significant advantages over priorrelated methods of manufacturing or fabricating complex structures, someof which are recited here and throughout the following more detaileddescription. Each of the advantages recited herein will be apparent inlight of the detailed description as set forth, with reference to theaccompanying drawings. These advantages are not meant to be limiting inany way. Indeed, one skilled in the art will appreciate that otheradvantages may be realized, other than those specifically recitedherein, upon practicing the present invention.

With reference to FIG. 1, illustrated is a block diagram depicting amethod for manufacturing or fabricating a complex structure, accordingto one exemplary embodiment of the present invention. As shown, themethod comprises the following steps. Step 14 comprises obtaining asupport plate having a pre-determined, patterned recess formed in asurface thereof. Step 18 comprises depositing a first series ofindividual flexible interconnects into the recess, the flexibleinterconnects being aligned parallel to one another in a common planeand supported by the support plate. Step 22 comprises adhering, withadhering means, at least one rigid member to each of the flexibleinterconnects of the first series. Step 26 comprises adhering, withadhering means, a second series of individual flexible interconnects tothe rigid members to form a plurality of stations, wherein each of thesecond series of flexible interconnects is adhered to two rigid membersof adjacent flexible interconnects of the first series, the flexibleinterconnects of the second series being formed perpendicular to theflexible interconnects of the first series. Step 30 comprises curing theadhering means to form an assembled, layered structure. Step 34comprises removing the layered structure from the support plate andfolding, systematically, the layered structure on itself and causing atleast some of the stations to be supported about a central spine in asegmented manner. In an alternative embodiment, the flexibleinterconnects on either side of the rigid members may comprise a singlestrand of material rather than a plurality of individual pieces.

FIGS. 2-6 illustrate the steps recited above as applied to themanufacture of a specific exemplary type of complex structure. Morespecifically, FIGS. 1-6 illustrate the various components and elementsinvolved in manufacturing a segmented complex structure in accordancewith the steps recited above, wherein the complex structure is in theform of a guidewire having a plurality of performance stationsconfigured with the ability to support a plurality of on-board systemscapable or performing one or more mechanical, electrical,electro-mechanical, or other functions. With specific reference to FIG.2, illustrated is a support plate 40 having an upper surface 44 and arecessed portion 48 formed in the upper surface 44. The support plate 40effectively functions as a template having a pattern 52 for laying out,in a two-dimensional manner, the various components used to make up thecomplex structure. The recessed portion 48 conforms to or comprises thedesired pattern 52. The recessed portion 48 and pattern 52 formed in thesupport plate 40 further functions to properly align each of thecomponents as they are laid out by providing boundaries. As shown, theboundary 56 of the pattern 52 comprises the edges of the recessedportion 48. In another exemplary embodiment, the boundary may beprovided by a build-up extending above the surface 44 of the supportplate 40, wherein the components of the complex structure are laid uponthe surface 44 rather than within a recessed portion.

The size and geometry of the particular pattern 52 may vary dependingupon the type or configuration of complex structure desired to beproduced. In the exemplary embodiment shown, the pattern comprises astep-like configuration, with a plurality of similarly sized rectangularshaped segments with rounded ends arranged in an overlapping manner onewith another. Obviously, other patterns may be formed in the supportplate 40 as will be recognized by those skilled in the art. In addition,the support plate 40 may be used to form a continuous complex structureor various segments of a complex structure. In the embodiment shown, andin light of the high aspect ratio of guidewires, the support plate 40 ismost likely used to form various segments of a complex guidewirestructure due to its small size and the relatively small number ofcomponents able to be laid out about the support plate 40, as shown. Ofcourse, the support plate 40 may comprise larger sizes capable offacilitating the formation of much larger complex structures orsegments.

The recessed portion 48 may be configured to accommodate and support thelayout of components of various sizes. In one aspect, the recessedportion 48 may comprise any depth (or alternatively, any buildups maycomprise any height) or varying depths (or alternatively varying buildupheights), depending upon the complex structure to be formed. Forexample, the recess 48 may not be required to be as deep to accommodateand support those components used to make up a simple guidewirestructure having no on-board systems, as opposed to the depth that maybe needed to accommodate and support a complex structure having one ormore on-board components, such as a mechanical actuator or other systemor device.

The support plate 40 may comprise any metal or non-metal materialcapable of supporting the various complex structure components in placeduring the manufacturing process. And, as indicated above, the supportplate 40 may be configured to comprise any size and geometricconfiguration.

In forming the complex guidewire structure, a first series or set ofindividual flexible interconnects 70 are laid out in a common planewithin the recess 48. In other words, the flexible interconnects 70 areconfigured to be usable within a two-dimensional layout. Each flexibleinterconnect 70 is further configured to provide the foundation forreceiving all other components, which are also configured to be usablewithin a two-dimensional layout. The flexible interconnects 70 functionto operably interconnect one or more rigid members or stations of thecomplex guidewire structure. The interconnection between the rigidmembers or stations may provide multiple functions. For example, theinterconnects may be configured to provide mechanical support, or theymay be configured to comprise an electrical interconnection element,depending upon the makeup or configuration of the material used, or bothof these. In any event, the interconnects 70 between the rigid membersare intended to be flexible in order to facilitate the various movementsand functions of the segments and stations during use of the guidewirestructure. For example, it may be desired to configure the complexguidewire structure so that the rigid members or stations are able totwist, bend, extend, compress, or otherwise move with respect to oneanother. By being flexible, the interconnects 70 are able to likewisemove with the rigid members without sacrificing functionality. This isparticularly advantageous when the flexible interconnects 70 operate tocarry electrical current or signals. Thus, the present inventioncontemplates a variety of interconnect combinations being possible.

Each of the flexible interconnects 70 comprise a pre-determinedtwo-dimensional size and shape depending upon the particular complexstructure to be formed. As such, the pattern 52 formed in the supportplate 40 comprises a corresponding size and shape to accommodate orreceive the flexible interconnects 70, in two-dimensional form. In otherwords, the flexible interconnects 70 each comprise a two-dimensionalsize and shape that allows them to be properly supported within thepattern 52 of the support plate 40 during manufacturing. In keeping withthe exemplary embodiment, each of the flexible interconnects 70 comprisea two-dimensional form with a first surface 74, a second surface (notshown), a slot or slotted portion 82, which purpose or function will bediscussed in detail below, and a perimeter 86. In addition, the flexibleinterconnects 70 each comprise a rectangular shape with rounded ends, asthis shape will allow them to take on the desired configuration in thethree-dimensional complex structure when formed.

As shown in this particular two-dimensional layout, the first series offlexible interconnects 70 are all laid out so that they are oriented inthe same direction and in a parallel manner with respect to one another.Each flexible interconnect 70 is laterally offset from the other apre-determined distance. Each interconnect 70 is also offset from theother a pre-determined distance lengthwise (which distance is shown assubstantially half the length of a flexible interconnect). As such, thevarious interconnects 70 are positioned in a step-like manner withrespect to one another (as dictated by pattern 52). The recessed portion48 formed in the pattern 52 is configured to allow the flexibleinterconnects 70 to nest therein. As indicated above, the support plate40 may take on any configuration as long as it is capable of supportingthe flexible interconnects 70 in a proper orientation.

The flexible interconnects 70 may comprise any suitable material capableof flexing, such as plastic, polymer, shape memory alloy and polyimidefilm. In the embodiment shown, the flexible interconnects 70 eachcomprise thin-layer strips of metalized polyimide material, whichmaterial is commonly known in the art. Each piece of metalized polyimidefilm comprises a plurality of electrical connectors 90 configured toelectrically connect the metalized polyimide film to adjacent segmentsor stations and to other components making up the complex guidewirestructure, such as one or more electronic on-board components (e.g.,data or signal processing system). The metalized polyimide filmfacilitates the carrying of electrical current or signals along thelength of the complex structure from segment to segment or station tostation, which electrical signals may be used for a variety of purposes,such as to power certain components of on-board systems located on thevarious segments or stations of the complex guidewire structure.Moreover, if desired, by providing electrical intercommunication, thevarious rigid members or stations of the complex guidewire structure, orindividual stations, may be addressed and networked together. Inaddition, the complex guidewire structure may be multiplexed, allowingany number of stations to communicate with one another and/or withvarious input and output devices, such as a computer. The concepts ofaddressing, networking, and multiplexing are discussed in greater detailbelow.

As mentioned above, in another exemplary embodiment, the flexibleinterconnects may comprise a single strand of material, such as a singlestrand of metalized polyimide film, sized and shaped to fit within thepattern 52 in a similar manner as the individual flexible interconnectpieces. The same is true for the flexible interconnects on the oppositeside of the rigid members, as discussed below. The single strandflexible interconnect will still comprise the necessary slots orapertures to accommodate a central spine, as well as any electricalconnectors, conduits, etc. desired.

With reference to FIGS. 3-A and 3-B, shown are a plurality of rigidmembers 102 disposed within the recessed portion 48 of the upper surface44 of the support plate 40, and positioned or aligned over the ends ofeach of the flexible interconnects 70. The rigid members 102 arecomprised of circular discs having an first surface 106, a secondsurface (not shown), an aperture 114 centrally formed therein, and aperimeter 118 defining a circle.

Prior to disposing the rigid members 102 over the flexible interconnects70, adhering means, such as an adhesive or solder paste, is applied tothe areas where the rigid members 102 will be attached to the flexibleinterconnects 70, or where electrical connectivity is required ordesired. The adhering means functions to operably attach the rigidmembers 102 to the flexible interconnects 70, such as to electricallyconnect the rigid member with the electrical components of the flexibleinterconnect (e.g., the electrical connectors and/or electrical conduitsin the polyimide material). In some embodiments, a suitable adheringmeans may be used to electrically connect the electrical connectors inthe flexible interconnect 70 (see electrical connectors 90 in FIG. 2) tothe rigid members 102, thus allowing the rigid members 102 to carry anelectrical current through one or more electrical conduits supportedthereon, and to electrically connect one or more on-board systems, ifdesired.

The rigid members 102 may comprise various types of materials, namelythose selected from both metals and non-metals. In one exemplaryembodiment, the rigid members 102 may be comprised of computer chips orsilicon substrates with circuitry and data processing/storing componentsthereon, thus providing the ability for the rigid member to function asan intelligent performance station, such as a circuit board. In anotherexemplary embodiment, the rigid members 102 may be comprised of metalwhere additional support capabilities are needed. Indeed, variouscombinations of material are also contemplated. In essence, the rigidmembers 102 are configured to function as support stations, and whereappropriate, performance stations (e.g., intelligent, mechanical, etc.),that are independent of one another except through their interconnectionvia the flexible interconnects 70.

Other than circular, one skilled in the art will recognize that therigid member 102 may comprise other shapes and sizes, depending upon theparticular design of the complex structure being formed.

The rigid members 102 preferably comprise a diameter that is at least aslong as the flexible interconnects 70 are wide. In addition, the rigidmembers 102 may comprise a cross-section selected from the groupconsisting of a plane geometry shape and an arbitrary shape, as known inthe art. However, this is not intended to be limiting as other sizes maybe useful. In the embodiment shown, the rigid members 102 comprise adiameter that is the same or substantially the same length as the widthof the flexible interconnects 70. In addition, the radius of the roundedends of the flexible interconnects 70 are the same or substantially thesame as the radius of the rigid members 102, thus allowing a portion oftheir perimeters 86 and 118, respectively, to match. The rigid members102 are positioned over the ends of the flexible interconnects 70, oneat each end, thus leaving a small gap between the two rigid members 102on any given flexible interconnect, and thus leaving a portion of theslot 82 exposed, or not covered. In addition, adjacent rigid members 102located on adjacent flexible interconnects are also separated a givendistance, for the purpose of leaving exposed a portion of the slot ofthe second series of flexible interconnects, as discussed below.

Once all of the rigid members 102 are in place and adhering means hasbeen applied, the process of forming a complex structure involvesdisposing a second series of flexible interconnects over the firstseries and the rigid members, and aligning or positioning these in theirproper place. With reference to FIG. 4, illustrated is a plurality of asecond series of flexible interconnects 132 as overlaid upon the rigidmembers 102. As shown, the second series of flexible interconnects 132are all laid out so that they are oriented in the same direction and ina parallel manner with respect to one another, but perpendicular ororthogonal to the first series of flexible interconnects 70. Eachflexible interconnect 132 is laterally offset from the other apre-determined distance. Each interconnect 132 is also offset from theother a pre-determined distance lengthwise (which distance is shown assubstantially half the length of a flexible interconnect). As such, thevarious first and second series of flexible interconnects 70 and 132 arepositioned in a step-like manner with respect to one another (asdictated by pattern 52). As with the first series, the recessed portion48 formed in the pattern 52 is configured to support the second seriesof flexible interconnects 132 and to allow the second series of flexibleinterconnects 132 to nest therein as overlaid upon the rigid members102.

The second series of flexible interconnects 132 are similar to the firstseries in that they comprise a two-dimensional form with a first surface136, a second surface (not shown), a slot or slotted portion 144, and aperimeter 148. In addition, the flexible interconnects 132 each comprisea rectangular shape with rounded ends, as this shape will allow them totake on the desired configuration in the three-dimensional complexstructure when formed. The second series of flexible interconnects 132may also comprise electrical connectors 152, similar to and thatfunction as those disposed on the first series of flexibleinterconnects. The second series of flexible interconnects 132 maycomprise any size, shape, material, etc. as discussed above with respectto the first series of flexible interconnects.

Prior to laying out and aligning or positioning the second series offlexible interconnects 132, adhering means, such as an adhesive orsolder paste, is applied to the areas where the rigid members 102 willbe attached to the flexible interconnects 132, or where electricalconnectivity is required or desired. The adhering means functions toattach the rigid members 102 to the second series of flexibleinterconnects 132 in the same manner as discussed above. As such, therigid members 102, with their flexible interconnect counterparts, becomedefined stations to be disposed and situated in their proper place tomake up the complex structure.

Moreover, and also prior to laying out and aligning the second series offlexible interconnects 132, various on-board systems or components ordevices may be laid out and attached to one or more of the rigid members102. For example, in the event a particular rigid member or station isto function as a performance station, such as an intelligent performancestation in the form of a computer chip, all of the necessary dataprocessing, data storage, and circuitry may be applied to the rigidmember 102 at this time. Other on-board systems may include valvingsystems, micro cameras, actuators, deployment systems, etc. Forinstance, the on-board systems may enable the rigid members to functionas mechanical or fluid or electro-mechanical performance stations. Forexample, the rigid members may support actuators and valves operablewith the actuators, which actuators and valves may be in fluidcommunication with a hydraulic bus running parallel to the centralspine. In essence, the present invention contemplates any component,system or device functioning an on-board system and being incorporatedinto the layered, two-dimensional layout used to ultimately form thecomplex structure.

The on-board systems, depending upon their type and components, areoperably coupled or connected to the rigid members and/or the flexibleinterconnects. For instance, in the event of a rigid member beingconfigured with one or more data processing components, these componentsare electrically connected to the electrical components in the flexibleinterconnects, such as the electrical connectors and conduits (e.g.,those present on the polyimide film), and also any electrical componentslocated on the rigid members required for operation of the dataprocessing components. Once electrically connected, the data processingcomponents can perform their intended function of receiving,transmitting, and/or storing electrical signals received. The flexibleinterconnects provide an uninterrupted conduit for electrical signals tobe transmitted from any one station to any other station in the complexstructure and from any input device (such as a computer) incommunication with the complex structure to any station.

In addition, the complex structure may comprise one or more nodesexisting between the stations. Exemplary nodes include actuating devicesor systems, cameras, sensors, transmitters, etc.

Once all of the components discussed above are properly positioned andattached to one another, the adhering means may then be cured tocomplete the formation of the two-dimensional assembly. One exemplarycuring process comprises covering the layered two-dimensional structurewith a top plate and exposing the same to a pre-determined temperaturefor a pre-determined duration of time. Other curing procedures used tocure the adhering means will be apparent to those skilled in the art.

With reference to FIG. 5, once the adhering means is cured, thetwo-dimensional assembly is removed from the support plate and threadedalong a central spine 160 by systematically folding the flexibleinterconnects 70 and 132, and therefore the rigid members 102, about oneanother. Upon folding the interconnects, the central spine 160 isinserted through the portion of the slots in each of the flexibleinterconnects 70 and 132 left exposed between each of the rigid members132, as well as the apertures formed in the rigid members 102, as shown.The flexible interconnects 70 and 132 are preferably folded to locatethe flexible interconnects inside of or between each corresponding rigidmember as supported about the central spine. This process is continueduntil the each of the rigid members 102 is situated about the centralspine 160, as stations, with the flexible interconnects spanningtherebetween. Although not required, once in place, the rigid members102 may be attached or fixed to the central spine 160 at theirappropriate locations using any known attachment means.

The central spine 160 may comprise any type of support member, such as acompression member, capable of supporting the rigid members 102 inplace. Preferably, the central spine 160 will also be capable ofproviding the complex structure with torquability, pushability, andflexing characteristics.

The resulting structure comprises a three-dimensional complex structure10 formed from the above-described two-dimensional layout. Each of therigid members 102 function as or provide a station capable of performingone or more tasks. Indeed, as discussed herein, a station may be asimple support station contributing to the overall support of thecomplex structure, or a station may function as a performance station,wherein one or more on-board systems is configured to perform anintelligent (e.g., data processing, signal receiving, signaltransmitting, sensing, etc.) function, a mechanical function (e.g.,actuation, locomotion), a valving function, or some other function asrecognized by those skilled in the art. Advantageously, the stations ofthe complex structure are capable of supporting one or more operableon-board systems, as well as being able to receive and send signals,information, or other items to any other station in the complexstructure, to a node, or to a computer via the flexible interconnect andresulting electrical interconnection between the stations.

The complex structure is also capable of unique movements. Indeed, thecomplex structure may be configured to bend, torque, twist, extend, etc.to perform its intended function. One exemplary complex structure thatmay be formed using the present invention method may be similar to, inboth form and function, a complex guidewire. Another exemplary type ofcomplex structure may comprise a serpentine robot.

With reference to FIG. 6, illustrated is a formed three-dimensionalcomplex structure 10 with a plurality of electrical taps 170 situatedabout the central spine 160 and disposed between various stations on thecomplex structure 10. The electrical taps 170 may be used to confirmproper operation of any on-board systems existing on the variousstations, and may then be broken off upon confirmation.

FIG. 7 illustrates a graphical rendition of a three-dimensional complexstructure formed from a two-dimensional layout, according to oneexemplary embodiment of the present invention. Specifically, FIG. 7illustrates the various interconnections between the several stations.As shown, the complex structure 210 comprises a plurality of stations,namely stations 212-a, 212-b, 212-c, 212-d, and 212-e. Each of thesestations 212 are electrically interconnected to one another, and anynodes existing in the complex structure, such as node 222, via theelectrical connection 226. As such, any one station 212 may communicatewith any other station or any other node in the complex structure. Anyon-board systems, shown in FIG. 7 as on-board systems 218-b and 218-d,are electrically connected to the station supporting it, in this casestation 212-b and 212-d, respectively, thus allowing any station andassociated on-board system to also communicate with any other stationand/or on-board system, where appropriate. As indicated above, anystation having an on-board system may be considered a performancestation of some sort, thus FIG. 7 illustrates performance stations 220-band 220-d. The electrical connection 226 shown is carried along theflexible interconnects (not shown) described above. This type ofinterconnection provides significant advantages over prior relatedinterconnections as will be recognized by those skilled in the art.

In addition, each of these stations, and any nodes, may comprise anidentifier or address S_(x) (or N_(x) in the case of a node), thusproviding the complex 210 structure with a network of stations 212 andnodes 222.

The complex structure is further capable of being multiplexed together.Indeed, the flexible interconnects provide the ability to significantlyreduce the number of electrical wires running between the variousstations and a computer or other input source. In the embodiment shown,the complex structure 210 is electrically connected to computer 250 viaconnection 230.

The foregoing detailed description describes the invention withreference to specific exemplary embodiments. However, it will beappreciated that various modifications and changes can be made withoutdeparting from the scope of the present invention as set forth in theappended claims. The detailed description and accompanying drawings areto be regarded as merely illustrative, rather than as restrictive, andall such modifications or changes, if any, are intended to fall withinthe scope of the present invention as described and set forth herein.

More specifically, while illustrative exemplary embodiments of theinvention have been described herein, the present invention is notlimited to these embodiments, but includes any and all embodimentshaving modifications, omissions, combinations (e.g., of aspects acrossvarious embodiments), adaptations and/or alterations as would beappreciated by those in the art based on the foregoing detaileddescription. The limitations in the claims are to be interpreted broadlybased on the language employed in the claims and not limited to examplesdescribed in the foregoing detailed description or during theprosecution of the application, which examples are to be construed asnon-exclusive. For example, in the present disclosure, the term“preferably” is non-exclusive where it is intended to mean “preferably,but not limited to.” Any steps recited in any method or process claimsmay be executed in any order and are not limited to the order presentedin the claims. Means-plus-function or step-plus-function limitationswill only be employed where for a specific claim limitation all of thefollowing conditions are present in that limitation: a) “means for” or“step for” is expressly recited; and b) a corresponding function isexpressly recited. The structure, material or acts that support themeans-plus function are expressly recited in the description herein.Accordingly, the scope of the invention should be determined solely bythe appended claims and their legal equivalents, rather than by thedescriptions and examples given above.

1. A structure formed from a two-dimensional layout, said complexstructure comprising: a central spine; a plurality of stations situatedabout and supported on said central spine; and a flexible interconnectextending between each of said stations, said flexible interconnectbeing configured to operably interconnect said stations, said stationsbeing formed by adhering said flexible interconnects to a plurality ofrigid members within a two-dimensional layout and folding said rigidmembers and said flexible interconnects, once attached, about oneanother and threading said rigid members and said interconnects ontosaid central spine.
 2. The structure of claim 1, further comprising anon-board system operably configured on at least one of said stations,wherein said station functions as a performance station.
 3. Thestructure of claim 1, further comprising a node situated betweenadjacent stations, said node being operably attached to said flexibleinterconnects.
 4. The structure of claim 1, wherein each of saidstations and any nodes are addressed for networking purposes.
 5. Thestructure of claim 1, wherein said stations and said flexibleinterconnects are multiplexed together.
 6. A two-dimensional layout foruse in forming an elongate structure, said two-dimensional layoutcomprising: a support plate having a pre-determined, patterned recessformed in a surface thereof; a first series of individual flexibleinterconnects, said flexible interconnects having a pre-determinedconfiguration based on a patterned recess formed in a surface of asupport plate; at least one rigid member adhered to each of saidflexible interconnects of said first series; and a second series ofindividual flexible interconnects adhered to said rigid members, whereinan arrangement of a plurality of stations are formed, and wherein eachof said second series of flexible interconnects is adhered to two rigidmembers of adjacent flexible interconnects of said first series.
 7. Thetwo-dimensional layout of claim 6, wherein said rigid member is adheredto said first and second series of individual flexible interconnectswith a cured adhesive.
 8. The two-dimensional layout of claim 6, whereinsaid rigid members comprise an on-board system, and wherein saidstations are performance stations.
 9. The two-dimensional layout ofclaim 8, wherein said performance station is selected from the groupconsisting of an intelligent performance station, an electricalperformance station, a mechanical performance station, an actuationperformance station, an information gathering performance station, avalving performance station, a pumping performance station, and anelectro-mechanical performance station.
 10. The two-dimensional layoutof claim 8, wherein said flexible interconnect comprises an electricalcomponent that is electrically connected with said on-board system. 11.The two-dimensional layout of claim 6, wherein said flexibleinterconnects comprise a node that functions to provide an outputfunction and to be disposed between adjacent stations.
 12. Thetwo-dimensional layout of claim 6, wherein said flexible interconnectscomprise a material selected from the group consisting of plastic,polymer, shape memory alloy and metalized polyimide film.
 13. Thetwo-dimensional layout of claim 6, wherein said flexible interconnectsand said rigid members each comprise an aperture formed therein.
 14. Thetwo-dimensional layout of claim 6, wherein said second series offlexible interconnects are aligned parallel to one another andperpendicular to said first series of flexible interconnects.
 15. Thetwo-dimensional layout of claim 6, wherein said rigid members arecomprised of metal.
 16. The two-dimensional layout of claim 6, whereinsaid rigid member is comprised of silicone, said rigid memberfunctioning as a computer chip to facilitate one or more intelligentfunctions.